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1

Defence of Cultural Relativism

Journal:

Cultura International Journal of Philosophy of Culture and Axiology

Year:

2011

Language:

english

File:

PDF, 4.17 MB

english, 2011

2

How to Overcome Antirealists’ Objections to Scientific Realism

Journal:

Year:

2019

Language:

english

File:

PDF, 576 KB

english, 2019

3

Diagnostic Accuracy of the Neck Tornado Test as a New Screening Test in Cervical Radiculopathy

Park, Juyeon, Park, Woo Young, Hong, Seungbae, An, Jiwon, Koh, Jae Chul, Lee, Youn-Woo, Kim, Yong Chan, Choi, Jong Bum

Journal:

International Journal of Medical Sciences

Year:

2017

Language:

english

File:

PDF, 815 KB

english, 2017

4

Design, fabrication, and experimental characterization of a flap valve IPMC micropump with a flexibly supported diaphragm

Thanh Tung Nguyen, Nam Seo Goo, Vinh Khanh Nguyen, Youngtai Yoo, Seungbae Park

Journal:

Sensors and Actuators A: Physical

Year:

2008

Language:

english

File:

PDF, 1.03 MB

english, 2008

5

Problems with Using Evolutionary Theory in Philosophy

Journal:

Year:

2017

Language:

english

File:

PDF, 361 KB

english, 2017

6

Characterization of elasto-plastic behavior of actual SAC solder joints for drop test modeling

Tung T. Nguyen, Seungbae Park

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 1.59 MB

english, 2011

7

On the Evolutionary Defense of Scientific Antirealism

Journal:

Year:

2014

Language:

english

File:

PDF, 168 KB

english, 2014

8

A Note on the Normalized Approach to Simulating Moisture Diffusion in a Multimaterial System Under Transient Thermal Conditions Using ansys 14 and 14.5

Liu, Dapeng, Park, Seungbae

Journal:

Journal of Electronic Packaging

Year:

2014

Language:

english

File:

PDF, 397 KB

english, 2014

9

Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling

Yu, Da, Lee, Hohyung, Park, Seungbae

Journal:

Journal of Electronic Packaging

Year:

2012

Language:

english

File:

PDF, 2.47 MB

english, 2012

10

[IEEE 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI) - Turin, Italy (2016.5.8-2016.5.11)] 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI) - Simulation-based analysis on EMI effect in LPDDR interface for mitigating RFI in a mobile environment

Kim, Seil, Moon, Sungwook, Lee, Seungbae, Yi, Donny, Park, Goeun, Shin, Sangchul, Pae, Sangwoo

Year:

2016

Language:

english

File:

PDF, 720 KB

english, 2016

11

The Anti-induction for Scientific Realism

Journal:

Grazer Philosophische Studien

Year:

2018

Language:

english

File:

PDF, 150 KB

english, 2018

12

Statistical Analysis for Component Shift in Pick and Place Process of Surface Mount Technology

Cao, Shun, Parviziomran, Irandokht, Park, Seungbae, Won, Daehan

Journal:

Procedia Manufacturing

Year:

2019

Language:

english

File:

PDF, 771 KB

english, 2019

13

Surrealism Is Not an Alternative to Scientific Realism

Journal:

Logos & Episteme

Year:

2019

File:

PDF, 214 KB

2019

14

Failure analysis of contact probe pins for SnPb and Sn applications

Changsoo Jang, Seungbae Park, Bill Infantolino, Lawrence Lehman, Ryan Morgan, Dipak Sengupta

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 717 KB

english, 2008

15

Gain enhancement of a microstrip patch antenna using a circularly periodic EBG structure and air layer

Seungbae Park, Cheolbok Kim, Youngho Jung, Hosang Lee, Dongki Cho, Munsoo Lee

Journal:

AEU - International Journal of Electronics and Communications

Year:

2010

Language:

english

File:

PDF, 931 KB

english, 2010

16

Effect of Oxidation on Indium Solderability

Jongman Kim, Harry Schoeller, Junghyun Cho, Seungbae Park

Journal:

Journal of Electronic Materials

Year:

2008

Language:

english

File:

PDF, 852 KB

english, 2008

17

Effect of glue on reliability of flip chip BGA packages under thermal cycling

Tung T. Nguyen, Donggun Lee, Jae B. Kwak, Seungbae Park

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 1.15 MB

english, 2010

18

Dynamic responses of PCB under product-level free drop impact

Da Yu, Jae B. Kwak, Seungbae Park, John Lee

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 2.08 MB

english, 2010

19

High-cycle fatigue life prediction for Pb-free BGA under random vibration loading

Da Yu, Abdullah Al-Yafawi, Tung T. Nguyen, Seungbae Park, Soonwan Chung

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 1.60 MB

english, 2011

20

Transport phenomena in proton exchange membrane fuel cells and over-potential distribution of membrane electrode assembly

Dong-Myung Suh, Seungbae Park

Journal:

International Journal of Thermal Sciences

Year:

2012

Language:

english

File:

PDF, 1.19 MB

english, 2012

21

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Finite element based fatigue life prediction for electronic components under random vibration loading

Yu, Da, Al-Yafawi, Abdullah, Park, Seungbae, Chung, Soonwan

Year:

2010

Language:

english

File:

PDF, 1.54 MB

english, 2010

22

Accurate Assessment of Packaging Stress Effects on MEMS Sensors by Measurement and Sensor–Package Interaction Simulations

Xin Zhang, Seungbae Park, Judy, M.W.

Journal:

Journal of Microelectromechanical Systems

Year:

2007

Language:

english

File:

PDF, 1.47 MB

english, 2007

23

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Transient Dynamic Simulation and Full-Field Test Validation for A Slim-PCB Of Mobile Phone under Drop / Impact

Park, Seungbae, Shah, Chirag, Kwak, Jae, Jang, Changsoo, Pitarresi, James, Park, Taesang, Jang, Seyoung

Year:

2007

Language:

english

File:

PDF, 6.04 MB

english, 2007

24

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Random vibration test for electronic assemblies fatigue life estimation

Al-Yafawi, Abdullah, Patil, Saket, Yu, Da, Park, Seungbae, Pitarresi, James, Goo, Namseo

Year:

2010

Language:

english

File:

PDF, 984 KB

english, 2010

25

[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Effect of Boundary Conditions on the Dynamic Response Characterization Of Board-Level Drop Test

Park, Seungbae, Shah, Chirag, Kwak, Jae

Year:

2007

Language:

english

File:

PDF, 1.05 MB

english, 2007

26

Effects of Phase Change of Pb-Free Flip-Chip Solders During Board-Level Interconnect Reflow

Chung, Soonwan, Tang, Zhenming, Park, Seungbae

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 1.24 MB

english, 2007

27

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Temperature Effect of Interfacial Fracture Toughness on Underfill for Pb-Free Flip Chip Packages

Park, Seungbae, Tang, Zhenming, Chung, Soonwan

Year:

2007

Language:

english

File:

PDF, 1.71 MB

english, 2007

28

Predictive Model for Optimized Design Parameters in Flip-Chip Packages and Assemblies

Park, Seungbae, Lee, H. C., Sammakia, Bahgat, Raghunathan, Karthik

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2007

Language:

english

File:

PDF, 869 KB

english, 2007

29

Grain Deformation and Strain in Board Level SnAgCu Solder Interconnects Under Deep Thermal Cycling

Park, Seungbae, Dhakal, Ramji, Lehman, Lawrence, Cotts, Eric J.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2007

Language:

english

File:

PDF, 1.65 MB

english, 2007

30

Development of Inclined Conductive Bump for Flip-Chip Interconnection

Park, Ah-Young, Park, Seungbae, Yoo, Choong D.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2015

Language:

english

File:

PDF, 3.13 MB

english, 2015

31

Review of the F-16 Individual Aircraft Tracking Program

Lee, Hongchul, Cho, Hwanjeong, Park, Seungbae

Journal:

Journal of Aircraft

Year:

2012

Language:

english

File:

PDF, 2.83 MB

english, 2012

32

Thermodynamics and Kinetics of Oxidation of Pure Indium Solders

Schoeller, Harry, Kim, Jongman, Park, Seungbae, Cho, Junghyun

Journal:

MRS Proceedings

Year:

2006

Language:

english

File:

PDF, 210 KB

english, 2006

33

Optimal Material Properties of Molding Compounds for MEMS Package

Kim, Yeonsung, Lee, Hohyung, Zhang, Xin, Park, Seungbae

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2014

Language:

english

File:

PDF, 2.74 MB

english, 2014

34

[IEEE 2015 IEEE International Reliability Physics Symposium (IRPS) - Monterey, CA, USA (2015.4.19-2015.4.23)] 2015 IEEE International Reliability Physics Symposium - CPI reliability and EMI benefit for MIM CAP embedded C4 package

Chun, Hyunsuk, Baick, In Hak, Ha, Sang-Su, Kwon, Eunmi, Lee, Seungbae, Kim, Seil, Pae, Sangwoo, Park, Jongwoo

Year:

2015

Language:

english

File:

PDF, 470 KB

english, 2015

35

[ASME ASME 2006 International Mechanical Engineering Congress and Exposition - Chicago, Illinois, USA (November 5 – 10, 2006)] Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology - Viscoelastic Material Properties of SU-8 and Carbon-Nanotube-Reinforced SU-8 Materials

Park, Seungbae, Chung, Soonwan, Ackler, Harold, Makhar, Sandeep

Year:

2006

Language:

english

File:

PDF, 496 KB

english, 2006

36

Three-Dimensional and 2.5 Dimensional Interconnection Technology: State of the Art

Liu, Dapeng, Park, Seungbae

Journal:

Journal of Electronic Packaging

Year:

2014

Language:

english

File:

PDF, 2.27 MB

english, 2014

37

Investigation of Stress in MEMS Sensor Device Due to Hygroscopic and Viscoelastic Behavior of Molding Compound

Yeonsung Kim,, Dapeng Liu,, Hohyung Lee,, Ruiyang Liu,, Sengupta, Dipak, Seungbae Park,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2015

Language:

english

File:

PDF, 4.27 MB

english, 2015

38

Realism Versus Surrealism

Journal:

Foundations of Science

Year:

2016

Language:

english

File:

PDF, 384 KB

english, 2016

39

66-4: Effects of Display Curvature and Lateral Viewing Position on Spatial Presence and Image Quality for 55″ TVs

Park, Sungryul, Yi, Jihhyeon, Choi, Donghee, Lee, Songil, Kyung, Gyouhyung, Choi, Byeonghwa, Lee, Ja Eun, Lee, Seungbae

Journal:

SID Symposium Digest of Technical Papers

Year:

2016

Language:

english

File:

PDF, 582 KB

english, 2016

40

Prediction of deformation during manufacturing processes of silicon interposer package with TSVs

Kim, Yeonsung, Park, Ah-Young, Kao, Chin-Li, Su, Michael, Black, Bryan, Park, Seungbae

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 1.96 MB

english, 2016

41

Refutations of the Two Pessimistic Inductions

Journal:

Year:

2016

Language:

english

File:

PDF, 283 KB

english, 2016

42

An Eulerian approach for constructing a map between surfaces with different topologies

Park, Hangil, Cho, Youngjin, Bang, Seungbae, Lee, Sung-Hee

Journal:

Computer Graphics Forum

Year:

2016

Language:

english

File:

PDF, 9.06 MB

english, 2016

43

[ASME ASME 2006 International Mechanical Engineering Congress and Exposition - Chicago, Illinois, USA (November 5 – 10, 2006)] Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology - Solderability of Indium With Various Oxide Thickness

Park, Seungbae, Kim, Jongman, Cho, Junghyun, Schoeller, Harry

Year:

2006

Language:

english

File:

PDF, 4.61 MB

english, 2006

44

Advancement in simulating moisture diffusion in electronic packages under dynamic thermal loading conditions

Wang, Jing, Liu, Ruiyang, Liu, Dapeng, Park, Seungbae

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 2.44 MB

english, 2017

45

The Uniformity Principle vs. the Disuniformity Principle

Journal:

Year:

2017

Language:

english

File:

PDF, 277 KB

english, 2017

46

[ASME ASME 2006 International Mechanical Engineering Congress and Exposition - Chicago, Illinois, USA (November 5 – 10, 2006)] Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology - Wrinkling of Thin Membrane Under Thermal Loading

Gao, Jia, Park, Seungbae, Pitarresi, James, Homentcovschi, Dorel

Year:

2006

Language:

english

File:

PDF, 704 KB

english, 2006

47

Effect of Shield-Can on Dynamic Response of Board-Level Assembly

Yu, Da, Kwak, Jae, Park, Seungbae, Chung, Soonwan, Yoon, Ji-Young

Journal:

Journal of Electronic Packaging

Year:

2012

Language:

english

File:

PDF, 3.61 MB

english, 2012

48

Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem

Jang, Changsoo, Park, Seungbae, Han, Bongtae, Yoon, Samson

Journal:

Journal of Electronic Packaging

Year:

2008

Language:

english

File:

PDF, 797 KB

english, 2008

49

[ASME ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, California, USA (Monday 6 July 2015)] Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays - Shrinkage of Post-Cure Die Attach Adhesives During Isothermal Storage

Liu, Ruiyang, Lee, HoHyung, Park, Seungbae, Xue, Xiaojie

Year:

2015

Language:

english

File:

PDF, 2.65 MB

english, 2015

50

In Defense of the Epistemic Imperative

Journal:

Year:

2018

Language:

english

File:

PDF, 605 KB

english, 2018